HIGH SOLDARーG:Agent with improved solder wettability for nickel plating
Purpose:Heat and electrical insulation
HI SOLDAR―G is improved solderability of Ni plating by dipping after plating.
Characteristic
- Improve solderability of Ni plating
- No prevent conductivity
- Prevent oxidation of Ni plating film
- Easy treatment
Application
Used for connectors, lead frames, print substrate, nickel hoop plating, etc.
Peformance
Ageing of Solderability(6/4 Solder､230℃-10sec-No flux)
Test piece:Bright Ni(Watts Ni bath)
Peformance
-
Concentration 100～200 ml/L
Dissolution Pure water at 30℃
- Temperature Room temperature (20～30℃)
- Time 20～30 Sec.
- Ni plating ⇒ Rinse ⇒ Rinse ⇒ Dip into HIGH SOLDAR―G ⇒ Rinse ⇒ Dry
- Possible to use for Mat plating, Bright, Electroplating, Electroless plating.
- If solderability decrease by long standing, solderability recover by HIGH SOLDAR―G after reactivation.