HIGH SOLDARーG

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HIGH SOLDARーG:Agent with improved solder wettability for nickel plating

Purpose:Heat and electrical insulation

HI SOLDAR―G is improved solderability of Ni plating by dipping after plating.
HIGH SOLDARーG  image

Characteristic

  • Improve solderability of Ni plating
  • No prevent conductivity
  • Prevent oxidation of Ni plating film
  • Easy treatment

Application

Used for connectors, lead frames, print substrate, nickel hoop plating, etc.

Peformance

Ageing of Solderability(6/4 Solder、230℃-10sec-No flux)
Test piece:Bright Ni(Watts Ni bath)

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Peformance

  • Concentration 100~200 ml/L
    Dissolution Pure water at 30℃
  • Temperature Room temperature (20~30℃)
  • Time 20~30 Sec.
  • Ni plating ⇒ Rinse ⇒ Rinse ⇒ Dip into HIGH SOLDAR―G ⇒ Rinse ⇒ Dry
  • Possible to use for Mat plating, Bright, Electroplating, Electroless plating.
  • If solderability decrease by long standing, solderability recover by HIGH SOLDAR―G after reactivation.